At HBS modern newly equipped facility in Medstead Hampshire we offer the following services by our fully trained and vastly experienced team to IPC class 3 standards.
Covering conventional through-hole and surface-mount technologies, CEMS offers a wide range of stable assembly processes for all current component packages, including beam lead diodes, 0201's, CSP/micro and BGA's.
Through Hole Assembly.
All through hole component assembly can be carried out in RoHS or Leaded to meet your industry sectors requirements to IPC class 1, 2 or 3.
Our team has many years’ experience of building products having moving mechanical actions and integrated electronic mechatronics assemblies.
HBS provides a full system assembly service for products of all shapes and sizes including hand held terminals, chassis and 19” cabinets, supplied fully tested and configured.
Test & Diagnostics Services
As Military, Aerospace and Commercial designers we can offer fast and cost effective design solutions for all your PCB requirements.
Serving some of the most demanding industry sectors in the world, HBS has developed a culture of high quality and reliability in all aspects of the business within The MEL Group under ISO 9001:2008
HBS offers a range of in-house design engineering services, including product miniaturisation, electronics and microelectronics; both analogue and digital, mechanical, mechatronics and mechanical CAD. To these services can be added a wider range of specialist design engineering capabilities by way of The MEL Group. HBS offers full new product design services.
The HBS facility in Hampshire provides a range of assembly services including rapid prototype assembly of PCB and system assemblies using consigned and procured materials. The plant also offers a range of manufacturing engineering and test engineering services.